International Journal of Application or Innovation in Engineering & Management
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ISSN 2319 – 4847
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Call for Paper, Published Articles, Indexing Infromation ULTRAPRECISION HIGH RATE ANODIC DISSOLUTION PROCESSES IN ECM, Authors : Anil Chourasia, Sumit Kumar Singh, Dr. Pankaj Agrawal, International Journal of Application or Innovation in Engineering & Management (IJAIEM), www.ijaiem.org
Volume & Issue no: Volume 3, Issue 10, October 2014

Title:
ULTRAPRECISION HIGH RATE ANODIC DISSOLUTION PROCESSES IN ECM
Author Name:
Anil Chourasia, Sumit Kumar Singh, Dr. Pankaj Agrawal
Abstract:
ABSTRACT As electronic packages become smaller in size, the pitch of metal line is getting shorter. Decrease of line pitch in electronic packages and substrate of electronic component causes the electrochemical migration (ECM) more frequently. If the electronic components are exposed to high temperature and high humidity environments with authorized voltage condition, the metals in packages and substrate are easily ionized and form conductive dendrites, leading to insulation failure. ECM process consists of three steps: anodic dissolution, ion migration, and dendritic growth. Under low concentration of passivating electrolyte, low machining voltage and high-frequency short-pulse current, the machining gap can be reduced to about 10 mum. A deep microhole about 100 mum in diameter was drilled by edge-cut electrode on stainless steel with 750 mum thickness. The process of NC micro-EC milling is proposed, and microstructures with high-aspect ratio on stainless steel were fabricated by micro-EC milling, such as profiled micro-hole, micro spiral beam and micro array square columns
Cite this article:
Anil Chourasia, Sumit Kumar Singh, Dr. Pankaj Agrawal , " ULTRAPRECISION HIGH RATE ANODIC DISSOLUTION PROCESSES IN ECM " , International Journal of Application or Innovation in Engineering & Management (IJAIEM), Volume 3, Issue 10, October 2014 , pp. 347-354 , ISSN 2319 - 4847.
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